Following is the transcript of the video. Narrator: This is 2D hand-drawn animation. [horns toot] And this is 3D computer-generated animation. But many films actually fall somewhere in between -- or ...

DEAR BONNIE: I have been hearing about moving into a 5D world of consciousness, and I am not sure exactly what that entails, but I am noticing a difference in my attitude about what is acceptable and ...

A new wave of 2.5D/3D, fan-out and other advanced IC packages is expected to flood the market over the next year. The new packages are targeted to address many of the same and challenging applications ...

Have you ever felt that reality is deeper than what meets the eye? That perhaps our everyday experience is just the surface ...

Broadcom Inc. has unveiled its revolutionary 3.5D eXtreme Dimension System in Package (XDSiP) platform, designed to empower consumer AI companies in developing advanced custom accelerators, or XPUs.

YOKOHAMA, Japan, Aug. 27, 2025 /PRNewswire/ -- Socionext, the Solution SoC company, today announced the availability of 3DIC support in its portfolio of well-proven capabilities for the delivery of ...

ANSYS Inc.’s ANSS flagship multiphysics analysis solutions are leveraged by Faraday Technology Corporation for the development of advanced designs for modern multi-die 2.5D/3D integrated circuits (ICs ...

D HBM-on-GPU design reaches record compute density for demanding AI workloadsPeak GPU temperatures exceeded 140°C without ...