Forbes contributors publish independent expert analyses and insights. In some of the more sci-fi imaginings of the AI era, there’s this envisioning of “robots making robots,” of software and hardware ...

Experts at the Table: Semiconductor Engineering sat down to discuss 3D-IC design challenges and the impact on stacked die on EDA tools and methodologies, with John Ferguson, senior director of product ...

Experts at the Table: Semiconductor Engineering sat down to discuss the role and impact of AI in chip design with Chuck Alpert, Cadence Fellow; Sathish Balasubramanian, head of product marketing and ...

For decades, the design of leading-edge chips has been a high-wire act—balancing tight deadlines, sophisticated workflows, and the relentless need to consult scattered, often outdated, sources of ...

In the race to launch advanced technologies, from the latest consumer electronics products to new applications of artificial intelligence (AI), one challenge often holds competitors back. It takes as ...

Monolithic integration has been the dominant approach to chip design since the rise of VLSI-based ASICs decades ago. In a monolithic design, all of the building blocks of integrated circuits such as ...

Apple is planning to overhaul its chip design for the 2026 iPhones, in a move that could mark the first time it uses advanced multi-chip packaging in a mobile device. It sounds complicated, but here’s ...

As demand grows for more powerful and efficient microelectronics systems, industry is turning to 3D integration—stacking chips on top of each other. This vertically layered architecture could allow ...

Santa Barbara-based ChipAgents.ai today announced it raised $21M in early funding to fuel growth for its agentic artificial intelligence platform for chip design and verification. Bessemer Venture ...

Funding from the U.S. National Science Foundation is part of a broader push to propel domestic computer chip manufacturing A $3 million grant from the U.S. National Science Foundation (NSF) to the ...